The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2007

Filed:

Oct. 25, 2001
Applicant:

Israel Schuster, Kiryat Tivon, IL;

Inventor:

Israel Schuster, Kiryat Tivon, IL;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01C 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The substrate () containing the via-hole () is inserted into an electrophoretic cell () and an electrode () (the 'first electrode') is placed on top of a first orifice of the via-hole(s) (), to be implemented with electrical component(s), so that the electrode () totally covers the first orifice. Electrically charged either conductive and/or non-conductive particles are provided by immersing the volume of the via-hole(s) () in a conductive medium () consisting of the electrically charged particles. An electric field is created between the first electrode () and a second electrode () through the via-hole(s) () and the conductive medium () and the electrically charged particles are precipitated on the inner surface of the first electrode () that is directed to the second orifice of the via-hole(s) (), until a desired portion of the volume of the via-hole(s) () is filled with a first layer of the charged particles having a desired thickness. More layers may be created by repeating this process using additional electophoretic cell(s), until remaining portion of the volume of the via-hole(s) () is filled with the additional charged particles.


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