The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
May. 20, 2003
Takahiro Watanabe, Shiga-ken, JP;
Koji Tanaka, Shiga-ken, JP;
Koji Furutani, Moriyama, JP;
Hideki Muto, Omihachiman, JP;
Takanori Uejima, Omihachiman, JP;
Norio Nakajima, Takatsuki, JP;
Takahiro Watanabe, Shiga-ken, JP;
Koji Tanaka, Shiga-ken, JP;
Koji Furutani, Moriyama, JP;
Hideki Muto, Omihachiman, JP;
Takanori Uejima, Omihachiman, JP;
Norio Nakajima, Takatsuki, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
The invention provides a composite high frequency component constituting a part of a microwave circuit having plural signal paths corresponding to their respective frequencies, comprising: a diplexer for coupling transmitting signals from the plural signal paths for transmission and distributing receiving signals into said plural signal paths for reception; plural high frequency switches for separating the plural signal paths into a transmission section and a reception section, respectively; plural filters introduced in the signal paths; said diplexer, said high frequency switch, and said filters being integrated into a ceramic multi-layer substrate formed by lamination of plural ceramic sheet layers. According to the above described composite high frequency component, the diplexer, the high frequency switches, and the filters which constitute the composite high frequency component are integrated into the ceramic multi-layer substrate formed by lamination of plural ceramic sheet layers. Thus, the matching and adjustment between the diplexer and the high frequency switches can be easily performed. It is unnecessary to provide a matching circuit for matching and adjusting the diplexer and the high frequency switches, and moreover, the high frequency switches and the filters.