The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2007

Filed:

May. 16, 2005
Applicants:

Hidehiko Yasui, Kariya, JP;

Hiroshi Ishiyama, Chiryu, JP;

Inventors:

Hidehiko Yasui, Kariya, JP;

Hiroshi Ishiyama, Chiryu, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are brought into contact with surfaces of neighboring cooling pipes. The semiconductor modules are classified into a plurality of groups mutually differentiated in their heat generation rates. And, any two semiconductor modules belonging to the same group having the highest heat generation rate are spaced from each other so that a cooling pipe is not sandwiched between these semiconductor modules in the laminating direction.


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