The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2007

Filed:

Jun. 14, 2005
Applicants:

Steven P. Young, Boulder, CO (US);

Ramakrishna K. Tanikella, Boulder, CO (US);

Sanjiv Stokes, Los Altos, CA (US);

Inventors:

Steven P. Young, Boulder, CO (US);

Ramakrishna K. Tanikella, Boulder, CO (US);

Sanjiv Stokes, Los Altos, CA (US);

Assignee:

Xilinx, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/177 (2006.01);
U.S. Cl.
CPC ...
Abstract

An interconnect structure in which 'diagonal' and 'straight' interconnect lines are interleaved to minimize coupling between adjacent interconnect lines. An interconnect structure for an integrated circuit comprises rows and columns of tiles. Interconnect lines extend at least in part along a first column of the tiles, the interconnect lines including straight and diagonal interconnect lines. A “straight” interconnect line interconnects at least two tiles in the first column, and a “diagonal” interconnect line interconnects a tile in the first column with at least one tile in a different column and row. The interconnect lines are laid out in parallel fashion such that no straight interconnect line is physically adjacent to more than one other straight interconnect line, and no diagonal interconnect line is physically adjacent to more than one other diagonal interconnect line. Optionally, no two physically adjacent interconnect lines drive in the same direction within the first column.


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