The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
Mar. 27, 2003
Shinobu Shigeta, Tateyama, JP;
Shinobu Shigeta, Tateyama, JP;
UMC Japan, Tateyama, JP;
Abstract
A semiconductor device capable of reducing its size and increasing the number of chips on a wafer, and a method of manufacturing the same are provided. When manufacturing a semiconductor device, an uppermost layer as a dedicated layer for pads are formed above a layer in which power supply/ground wiring lines and wiring lines for supplying associated control signals to a memory cell unit and a control circuit are formed. The uppermost layer of the semiconductor device is comprised only of a plurality of padsas an electrode for providing electrical connection with an external connection line for transmitting a signal to and from the semiconductor device, a plurality of contact holesfor providing electrical connection with lower wiring lines formed in a lower layer below the uppermost layer, and uppermost wiring linesfor connecting the plurality of padsto the plurality of contact holescorrespondingly. In this case, the layout of the plurality of pads is made common regardless of the type of product.