The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
Feb. 18, 2003
Zequn Mei, Fremont, CA (US);
Richard D. Bjorn, Milpitas, CA (US);
Frans Kusnadi, San Jose, CA (US);
John Cameron Major, San Jose, CA (US);
Zequn Mei, Fremont, CA (US);
Richard D. Bjorn, Milpitas, CA (US);
Frans Kusnadi, San Jose, CA (US);
John Cameron Major, San Jose, CA (US);
K2 Optronics, Inc., Sunnyvale, CA (US);
Abstract
An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad. The fiber is disposed along a second axis in the region of the bond pad where the second axis is at a non-zero angle (possibly, but not necessarily a right angle) with respect to the first axis.