The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
Dec. 30, 2004
Luu Thanh Nguyen, Sunnyvale, CA (US);
Ken Pham, San Jose, CA (US);
Peter Deane, Los Altos, CA (US);
William Paul Mazotti, San Martin, CA (US);
Bruce Carlton Roberts, San Jose, CA (US);
Jia Liu, San Jose, CA (US);
Luu Thanh Nguyen, Sunnyvale, CA (US);
Ken Pham, San Jose, CA (US);
Peter Deane, Los Altos, CA (US);
William Paul Mazotti, San Martin, CA (US);
Bruce Carlton Roberts, San Jose, CA (US);
Jia Liu, San Jose, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.