The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
Jul. 01, 2003
Hidetaka Oka, Takarazuka, JP;
Masaki Ohwa, Kobe, JP;
James Philip Taylor, Macclesfield, GB;
Ciba Specialty Chemicals Corp., Tarrytown, NY (US);
Abstract
The invention relates to a process for preparing a dry film resist by forming a photocurable resin composition onto a support film with a thickness of 1 to 50 μm and optionally laminate a protective film onto the photocurable composition layer to obtain a dry film resist; whereby the photocurable resin is formed from a homogeneous mixture comprising (a) from 20–90 wt % of an alkaline soluble binder oligomer or polymer; (b) from 5 to 60 wt % of one or more photopolymerizable monomers which are compatible with the oligomers and polymers of component (a); (c) from 0.01 to 20% by weight of one or more photoinitiators; (d) from 0 to 20% by weight of additives and/or assistants; and (e) from 0.1 to 10% by weight of a leuco triphenylmethane dye of the formula (I), wherein Ris a residue selected from (II), Ris C–Calkyl or phenyl which may be mono-, di- or tri-substituted by C–Calkyl, trifluoromethyl, Calkoxy, Calkylthio, halogen and nitro; Ris hydrogen or C–Calkyl; Rto Rindependently of one another are hydrogen or C–Calkyl; X is O, S, NH or N—C–C-alkyl; (a) to (e) being 100% by weight. The above composition is useful to avoid unfavourable colour generation during the heat lamination