The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2007

Filed:

Jun. 11, 2002
Applicants:

Hiroshi Konuma, Nagano, JP;

Katsuhiko Yamazaki, Nagano, JP;

Takenori Umikawa, Nagano, JP;

Masakazu Yagi, Chiba, JP;

Tamotsu Yamashita, Chiba, JP;

Inventors:

Hiroshi Konuma, Nagano, JP;

Katsuhiko Yamazaki, Nagano, JP;

Takenori Umikawa, Nagano, JP;

Masakazu Yagi, Chiba, JP;

Tamotsu Yamashita, Chiba, JP;

Assignee:

Showa Denko K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 9/00 (2006.01); H01B 1/08 (2006.01); H01B 1/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A formed substrate, wherein the surface of the valve-acting metal having a dielectric film is at least partially covered with an oxide comprising Si, valve-acting metal element and oxygen, preferably, wherein the content of Si in the formed foil having an aluminum oxide dielectric film decreases continuously from the surface of the dielectric film toward the inner part in some regions in the aluminum dielectric film thickness; a method for producing the formed substrate; and a solid electrolytic capacitor comprising a solid electrolyte on the formed substrate. A solid electrolytic capacitor manufactured by using a formed substrate according to the present invention, improved in adhesion to an electrically conducting polymer (solid electrolyte) with its area coverage contacting the polymer being sufficiently large, is increased in the electrostatic capacitance among individual capacitors and improved in the LC yield as compared with capacitors otherwise manufactured.


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