The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
Nov. 28, 2005
Applicants:
Christopher J. Rueb, St. Paul, MN (US);
Richard J. Webb, Inver Grove Heights, MN (US);
Bhaskar V. Velamakanni, Woodbury, MN (US);
Inventors:
Christopher J. Rueb, St. Paul, MN (US);
Richard J. Webb, Inver Grove Heights, MN (US);
Bhaskar V. Velamakanni, Woodbury, MN (US);
Assignee:
3M Innovative Properties Company, St. Paul, MN (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.