The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
Dec. 10, 2004
Manfred Pröll, Dorfen, DE;
Jürgen Auge, Unterhaching, DE;
Stephan Schröder, München, DE;
Thomas Huber, München, DE;
Manfred Pröll, Dorfen, DE;
Jürgen Auge, Unterhaching, DE;
Stephan Schröder, München, DE;
Thomas Huber, München, DE;
Infineon Technologies AG, Munich, DE;
Abstract
In an arrangement for determining a temperature loading during a soldering process, a semiconductor chip () comprises at least one contact () to be soldered or is electrically conductively connected to at least one contact () to be soldered that is situated outside the semiconductor chip. The semiconductor chip () furthermore comprises a temperature sensor device (), which determines a measurement quantity corresponding to the temperature. A processing device () has an analog-to-digital converter (), which is electrically conductively connected to the temperature sensor device () and converts the measurement quantity into at least one storable signal that represents the temperature loading. A voltage supply device (), which is electrically conductively connected to the temperature sensor device () and the processing device (), supplies these components with an operating voltage. A data memory () serves for storing the at least one storable signal. An electrical line () connected to the data memory () serves for outputting the stored signal. As a result, it is possible to monitor temperature loadings of the semiconductor chip also outside the sphere of influence of the semiconductor manufacturer.