The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2007
Filed:
Oct. 30, 2002
Toshio Sugawa, Katano, JP;
Yoshihisa Takase, Higashiosaka, JP;
Toshio Sugawa, Katano, JP;
Yoshihisa Takase, Higashiosaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A circuit board is provided in which peeling strength is prevented from decreasing and a connection resistance to a conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has a metal film for covering a through hole on at least one surface of an insulating substrate having the through hole filled with the conductive material. An uneven layer with a thickness of 5 μm or more is formed on a surface of the metal film, and a metal layer is formed on the opposite surface to the uneven layer.