The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2007
Filed:
Apr. 29, 2004
Michael W. Chaw, San Jose, CA (US);
Dan J. Dawson, San Jose, CA (US);
Craig J. Hawker, Los Gatos, CA (US);
James L. Hedrick, Pleasanton, CA (US);
Wesley L. Hillman, Morgan Hill, CA (US);
Teddie P. Magbitang, San Jose, CA (US);
Dennis R. Mckean, Milpitas, CA (US);
Robert D. Miller, San Jose, CA (US);
Willi Volksen, San Jose, CA (US);
Michael W. Chaw, San Jose, CA (US);
Dan J. Dawson, San Jose, CA (US);
Craig J. Hawker, Los Gatos, CA (US);
James L. Hedrick, Pleasanton, CA (US);
Wesley L. Hillman, Morgan Hill, CA (US);
Teddie P. Magbitang, San Jose, CA (US);
Dennis R. McKean, Milpitas, CA (US);
Robert D. Miller, San Jose, CA (US);
Willi Volksen, San Jose, CA (US);
Hitachi Global Storage Netherlands, B.V., Amsterdam, NL;
Abstract
A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant comprised of different first and second polymers The solid encapsulant is comprised of a polymer prepared by polymerizing an encapsulant fluid comprising a homogeneous mixture of first and second constituents. The first constituent is comprised of a first monomer suitable for in situ polymerization to form the first polymer. The second constituent is comprised of the second polymer or a second monomer suitable for in situ polymerization to form the second polymer. The first constituent does not substantially react with the second constituent. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.