The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2007
Filed:
Jul. 23, 2003
Tomohei Sugiyama, Aichi-ken, JP;
Kyoichi Kinoshita, Aichi-ken, JP;
Takashi Yoshida, Aichi-ken, JP;
Hidehiro Kudo, Aichi-ken, JP;
Eiji Kono, Aichi-ken, JP;
Tomohei Sugiyama, Aichi-ken, JP;
Kyoichi Kinoshita, Aichi-ken, JP;
Takashi Yoshida, Aichi-ken, JP;
Hidehiro Kudo, Aichi-ken, JP;
Eiji Kono, Aichi-ken, JP;
Kabushiki Kaisha Toyota Jidoshokki, Kariya, JP;
Abstract
A mold is filled with unsintered SiC particles and a melt of Al or of an Al alloy containing Si is poured into the mold for high pressure casting. Owing to the SiC particles and Si precipitated upon casting, a low expansion material having a low thermal expansion coefficient is produced. A heat transmission path is formed by Al infiltrating spaces between the SiC particles and therefore high heat conductivity is obtained.