The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2007
Filed:
Dec. 10, 2003
Hendrik Pieter Hochstenbach, Nijmegen, NL;
Andrea Henricus Maria Van Eck, Nijmegen, NL;
Rintje Van Der Meulen, Nijmegen, NL;
Hendrik Pieter Hochstenbach, Nijmegen, NL;
Andrea Henricus Maria Van Eck, Nijmegen, NL;
Rintje Van Der Meulen, Nijmegen, NL;
NXP B.V., Eindhoven, NL;
Abstract
The electronic device () is a chip-on-chip construction on a lead frame () comprising a heat sink () in an encapsulation (). The first chip () and the second chip () are mutually connected by first conductive interconnections () and the first chip () is connected to the lead frame () by second conductive interconnections () which preferably have a lower reflow temperature than the first conductive interconnections (). By heating the device () the adhesive layer () will first shrink, causing a stress, which will be relaxated by reflowing the second conductive interconnections ().