The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2007
Filed:
Jun. 02, 2004
William Michael Oliver, Cincinnati, OH (US);
Douglas J. Robinson, Cincinnati, OH (US);
Jon T. Sharrah, Mason, OH (US);
Alford Jack Ramey, Waynesville, OH (US);
John A. Lynch, Hamilton, OH (US);
William Michael Oliver, Cincinnati, OH (US);
Douglas J. Robinson, Cincinnati, OH (US);
Jon T. Sharrah, Mason, OH (US);
Alford Jack Ramey, Waynesville, OH (US);
John A. Lynch, Hamilton, OH (US);
Planet Products Corporation, Cincinnati, OH (US);
Abstract
A heat sealer having a heated platen, a cylinder for reciprocating the platen, a die positioned to be engaged by the platen and a shuttle supporting the die to move the die from a platen-engaging position to a non-engaging position, and a control for controlling the temperature of the platen and the force applied to the platen against the die by the cylinder. The invention also includes a temperature sensor for sensing the surface temperature of the platen and a load sensor for sensing the force applied by the platen to the die. In one embodiment, the temperature sensor is an infrared temperature sensor that reads the surface temperature of the platen and the load sensor is a load cell positioned beneath the die and supporting the die so that the load sensors can measure the direct force applied by the platen against the die. Also, in one embodiment, the infrared sensor is positioned beneath the die so that it can read the platen temperature when the die is displaced to the non-engaging position.