The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2007
Filed:
Jun. 26, 2002
High-softening-point copolymer, process for producing the same, and product of hydrogenation thereof
Applicant:
Toyozo Fujioka, Chiba, JP;
Inventor:
Toyozo Fujioka, Chiba, JP;
Assignee:
Idemitsu Kosan Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08F 8/04 (2006.01); C08F 232/08 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are a high melting point copolymer prepared by heat-polymerizing cyclopentadiene and/or dicyclopentadiene and a vinyl-substituted aromatic compound, wherein a use amount of a solvent in heat polymerization is 0.1 time or more and less than 0.5 time based on the mass of the whole monomers, and the copolymer has a softening point falling in a range of 100 to 135° C., and a hydrogenated copolymer obtained by hydrogenating the above high melting point copolymer. The hydrogenated copolymer of the present invention is suitably used as an adhesion-providing resin having a high softening point for a hot melt adhesive.