The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2007
Filed:
Aug. 31, 2005
Luu Thanh Nguyen, Sunnyvale, CA (US);
Ken Pham, San Jose, CA (US);
Peter Deane, Los Altos, CA (US);
William Paul Mazotti, San Martin, CA (US);
Bruce Carlton Roberts, San Jose, CA (US);
Luu Thanh Nguyen, Sunnyvale, CA (US);
Ken Pham, San Jose, CA (US);
Peter Deane, Los Altos, CA (US);
William Paul Mazotti, San Martin, CA (US);
Bruce Carlton Roberts, San Jose, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.