The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
Apr. 29, 2004
Tsuyoshi Ogawa, Kanagawa, JP;
Yuji Nishitani, Kanagawa, JP;
Tsuyoshi Ogawa, Kanagawa, JP;
Yuji Nishitani, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A multi-chip circuit module on which semiconductor chips are loaded and which is provided with circuit patterns, input/output terminals or the like for interconnecting the semiconductor chips. A multi-layered wiring section () is formed by respective unit wiring layers () to () in such a manner that an upper unit wiring layer is layered on a surface-planarized subjacent unit wiring layer and connected to one another by inter-layer connection by a via-on-via structure. A semiconductor chip () mounted on this multi-layer wiring section () is polished along with the sealing resin layer () for reducing the thickness.