The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
Dec. 03, 2004
Applicants:
Reiko Yoshimura, Kanagawa, JP;
Tsukasa Tada, Tokyo, JP;
Koji Izunome, Niigata, JP;
Kazuhiko Kashima, Tokyo, JP;
Inventors:
Reiko Yoshimura, Kanagawa, JP;
Tsukasa Tada, Tokyo, JP;
Koji Izunome, Niigata, JP;
Kazuhiko Kashima, Tokyo, JP;
Assignee:
Toshiba Ceramics Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/167 (2006.01); H01L 29/207 (2006.01); H01L 29/227 (2006.01); H01L 31/0288 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor substrate includes a support substratehas gettering sitesfor gettering impurity metal, an embedded insulating filmwhich is provided on the support substrateand contains oxides of an element whose single bond energy to oxygen is higher than that to silicon, and a semiconductor layer (an SOI layer)provided on the embedded insulating film