The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
Oct. 27, 2003
John G. Woods, Farmington, CT (US);
Mark M. Konarski, Old Saybrook, CT (US);
Kyra M. Kozak, Rocky Hill, CT (US);
Yuhshi Luh, Orange, CT (US);
John G. Woods, Farmington, CT (US);
Mark M. Konarski, Old Saybrook, CT (US);
Kyra M. Kozak, Rocky Hill, CT (US);
Yuhshi Luh, Orange, CT (US);
Henkel Corporation, Rocky Hill, CT (US);
Abstract
In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are generally liquid rubbers which provided improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have a branched telechelic structure with terminal epoxide functional groups. The polyacrylate is typically obtained as a mixture of epoxidized polymer, chain extended polyoligomer and unreacted monomer. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq>2.0 lb/in) and capillary flow specifications (flow time<180 seconds) for many commercial underfill applications. In accordance with a further embodiment of the present invention, there are provided adhesive compositions comprising invention compounds and methods for use thereof. In additional embodiments of the present invention, there are provided methods for the preparation of invention toughening agents, methods for adhesively attaching a device to a substrate, and assemblies comprising first article(s) adhered to second article(s).