The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2007

Filed:

Aug. 22, 2005
Applicants:

Norinao Kouma, Kawasaki, JP;

Osamu Tsuboi, Kawasaki, JP;

Hisao Okuda, Kawasaki, JP;

Hiromitsu Soneda, Kawasaki, JP;

MI Xiaoyu, Kawasaki, JP;

Satoshi Ueda, Kawasaki, JP;

Ippei Sawaki, Kawasaki, JP;

Yoshitaka Nakamura, Yokohama, JP;

Inventors:

Norinao Kouma, Kawasaki, JP;

Osamu Tsuboi, Kawasaki, JP;

Hisao Okuda, Kawasaki, JP;

Hiromitsu Soneda, Kawasaki, JP;

Mi Xiaoyu, Kawasaki, JP;

Satoshi Ueda, Kawasaki, JP;

Ippei Sawaki, Kawasaki, JP;

Yoshitaka Nakamura, Yokohama, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a micro-structural unit is provided. By the method, micro-machining is performed on a material substrate including first through third conductive layers and two insulating layers, one of which is interposed between the first and the second conductive layers, and the other between the second and the third conductive layers. The method includes several etching steps performed on the layers of the material substrate that are different in thickness.


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