The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2007

Filed:

Dec. 20, 2005
Applicant:

Junichi Mitani, Kawasaki, JP;

Inventor:

Junichi Mitani, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing method of a semiconductor device comprises the steps of forming an etching stop insulating film () that covers at least side surfaces of a wiring () in a first region () and a first-stage conductive plug () in a second region (), then forming insulating films () on the etching stop insulating film () and the wiring (), then forming a hole () on a first-stage conductive plug () by etching a part of the insulating films () until the etching stop insulating film () is exposed, then exposing an upper surface of the first-stage conductive plug () by etching selectively the etching stop insulating film () through the hole (), and then forming a second-stage conductive plug () in the hole ().


Find Patent Forward Citations

Loading…