The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
Apr. 30, 2002
Applicants:
Jun Wei, Singapore, SG;
Zhiping Wang, Singapore, SG;
Hong Xie, Singapore, SG;
Inventors:
Assignee:
Agency for Science, Technology and Research, Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01); H01L 21/30 (2006.01); H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of bonding two components by depositing an amorphous and non-hydrogenated intermediate layer () on one of the components () and arranging the components () in spaced relationship with the intermediate layer () therebetween. The method further comprises heating one or both of the components () before bringing the components () into contact. Finally, a voltage is applied to the components () to create a permanent bond between the two components.