The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2007

Filed:

Feb. 22, 2005
Applicants:

John A. Andresakis, Clifton Park, NY (US);

Pranabes K. Pramanik, Clifton Park, NY (US);

Bruce Mahler, Thousand Oaks, CA (US);

Daniel Brandler, Moorpark, CA (US);

Inventors:

John A. Andresakis, Clifton Park, NY (US);

Pranabes K. Pramanik, Clifton Park, NY (US);

Bruce Mahler, Thousand Oaks, CA (US);

Daniel Brandler, Moorpark, CA (US);

Assignees:

Oak-Mitsui Inc., Hoosick Falls, NY (US);

Ohmega Technologies Inc., Culver City, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/08 (2006.01); H01C 1/012 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer, and a nickel-phosphorus electrical resistance material layer electroplated onto a second electrically conductive layer.


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