The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
May. 09, 2005
Stuart R. Macewen, Inverary, CA;
Peter Hamstra, Kingston, CA;
Robert William Mallory, Gananoque, CA;
Yihai Shi, Kingston, CA;
James D. Moulton, Kingston, CA;
Stuart R. MacEwen, Inverary, CA;
Peter Hamstra, Kingston, CA;
Robert William Mallory, Gananoque, CA;
Yihai Shi, Kingston, CA;
James D. Moulton, Kingston, CA;
Novelis Inc., Toronto, CA;
Abstract
In hydroforming of hollow metal articles in a die, such as pressure-ram-forming procedures, a method of decreasing cycle time of the forming process, while ensuring acceptable product properties and avoiding failures, by modeling the process using finite element analysis to establish a pressure-time history that optimizes the forming operation and applies failure limits to selected variables such as minimum wall thickness or maximum strain rate, and transferring this pressure-time history to a computer controlling the forming process. Thermocouple and/or continuity sensors are incorporated into the die wall and connected to the computer so as to provide active feedback from the die to the control of the process.