The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Nov. 26, 2002
Minehiro Tonosaki, Kanagawa, JP;
Eisaku Kato, Tokyo, JP;
Naoki Sano, Kanagawa, JP;
Koji Kitagawa, Kanagawa, JP;
Minehiro Tonosaki, Kanagawa, JP;
Eisaku Kato, Tokyo, JP;
Naoki Sano, Kanagawa, JP;
Koji Kitagawa, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A compact, thin type and high cooling performance cooling device, an electronic apparatus and a method of manufacturing the same are provided. The cooling device () has a pair of a first substrate () and a second substrate () which are made of such a material having a low thermal diffusibility as glass, formed rectangular and bonded together via a silicon member (). On bonding surfaces of these substrates () and (), grooves () and () are formed. These grooves () and () are formed so as to function as a heat pipe of a loop type when these substrates () and () are bonded.