The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2007

Filed:

Oct. 13, 2005
Applicants:

Sang Gi Kim, Daejeon, KR;

Ju Wook Lee, Daejeon, KR;

Jong Moon Park, Daejeon, KR;

Seong Wook Yoo, Daegu, KR;

Kun Sik Park, Daejeon, KR;

Yong Sun Yoon, Daejeon, KR;

Yoon Kyu Bae, Daejeon, KR;

Byung Won Lim, Daejeon, KR;

Jin Gun Koo, Daejeon, KR;

Boo Woo Kim, Daejeon, KR;

Inventors:

Sang Gi Kim, Daejeon, KR;

Ju Wook Lee, Daejeon, KR;

Jong Moon Park, Daejeon, KR;

Seong Wook Yoo, Daegu, KR;

Kun Sik Park, Daejeon, KR;

Yong Sun Yoon, Daejeon, KR;

Yoon Kyu Bae, Daejeon, KR;

Byung Won Lim, Daejeon, KR;

Jin Gun Koo, Daejeon, KR;

Boo Woo Kim, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 27/32 (2006.01); G03B 27/42 (2006.01); G03B 27/70 (2006.01); G03B 27/54 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a wafer exposure apparatus used in a semiconductor device manufacturing process, the exposure apparatus including: a reflective mirror for reflecting light provided from a light source; an optical path changer for changing a path of the light provided from the reflective mirror; first mirrors installed at both sides of the optical path changer to change the path of the light; second mirrors installed at both sides of a material to change the path of the light; and third mirrors installed at both sides of a mask to enter the light reflected by the first mirrors to the mask and to enter the light passed through the mask into the second mirrors, whereby it is possible to continuously expose one surface, both surfaces or a specific surface of a wafer in a state that the wafer is once aligned.


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