The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Jan. 07, 2002
Michael Cave, Pflugerville, TX (US);
Michael May, Austin, TX (US);
Mathew Rybicki, Austin, TX (US);
Timothy Markison, Austin, TX (US);
Michael Cave, Pflugerville, TX (US);
Michael May, Austin, TX (US);
Mathew Rybicki, Austin, TX (US);
Timothy Markison, Austin, TX (US);
ViXS Systems, Inc., Toronto, CA;
Abstract
A high frequency integrated circuit includes a die, a package and capacitive bond. The die includes a circuit that processes a high frequency signal and also includes at least one bonding pad coupled to the circuit. The package includes a plurality of bonding posts, at least one of the bonding posts is allocated to the at least one bond pad of the die. A bonding capacitor couples the at least one bond pad on the die to the at least one bond post of the package.