The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Mar. 31, 2004
Applicant:
Janne T Nurminen, Finland, FI;
Inventor:
Janne T Nurminen, Finland, FI;
Assignee:
Nokia Corporation, Espoo, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
An IC package dissipates thermal energy using thermally and electrically conductive thermal fingers. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive thermal fingers encompass the die pad area to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.