The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Feb. 17, 2004
Applicant:
Hiroshi Ishiyama, Chiryu, JP;
Inventor:
Hiroshi Ishiyama, Chiryu, JP;
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor module includes a semiconductor chip having a first surface and a second surface; a first electrode plate contacting the first surface of the semiconductor chip; a second electrode plate contacting the second surface of the semiconductor chip; and a resin mold for sealing the first and second electrode plates and the semiconductor chip. The resin mold includes an inner pressure release portion for releasing a pressure in the resin mold.