The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2007

Filed:

Jan. 31, 2005
Applicants:

Franz Dietz, Untereisesheim, DE;

Volker Dudek, Brackenheim, DE;

Michael Graf, Leutenbach, DE;

Inventors:

Franz Dietz, Untereisesheim, DE;

Volker Dudek, Brackenheim, DE;

Michael Graf, Leutenbach, DE;

Assignee:

Atmel Germany GmbH, Heilbronn, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 21/8242 (2006.01); H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
Abstract

Vertically insulated active semiconductor regions having different thicknesses in an SOI wafer, which has an insulating layer, is produced. On the wafer, first active semiconductor regions having a first thickness are arranged in a layer of active semiconductor material. The second active semiconductor regions having a relatively smaller thickness are produced by epitaxial growth proceeding from at least one seed opening in a trench structure. The second semiconductor regions are substantially completely dielectrically insulated, laterally and vertically, from the first semiconductor regions by oxide layers. The width of the seed opening can be defined by lithography.


Find Patent Forward Citations

Loading…