System and method for forming mold caps over integrated circuit devices

Abstract

A compression molding method for forming a mold cap over an integrated circuit structure is provided. A film is positioned adjacent a first die structure such that a mold block coupled to the film is located in a die cavity in the first die structure. The mold block comprises mold compound and at least substantially holding its own shape. An integrated circuit structure including one or more integrated circuit devices coupled to a substrate is positioned adjacent a second die structure. At least one of the first die structure and the second die structure is moved toward the other die structure to cause the integrated circuit structure to compress the mold block within the die cavity in order to form a mold cap covering at least one of the one or more integrated circuit devices.