The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7189597 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 13, 2007

Filed:

Dec. 29, 2004
Applicant:

Seung-ho Pyi, Ichon-shi, KR;

Inventor:

Seung-Ho Pyi, Ichon-shi, KR;

Assignee:

Hynix Semiconductor Inc., Kyoungki-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a semiconductor device with an improved contact margin between an interconnection line and a bit line and a method for fabricating the same. The semiconductor device includes: a bit line structure formed on a substrate and having a number of bit lines and a pad; a first inter-layer insulation layer formed on the bit line structure and the substrate and having a first opening exposing the pad; a conductive layer formed on the first inter-layer insulation layer and patterned to be a middle pad filled into the first opening and a plate electrode of a capacitor; a second inter-layer insulation layer formed on the first inter-layer insulation layer and the patterned conductive layer and having a second opening exposing the middle pad; and a metal layer filled into the second opening to form an interconnection line contacted to the pad.


Find Patent Forward Citations

Pyi, Seung-Ho. (2007). Semiconductor device and method for fabricating the same (U.S. Patent No. 7189597). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7189597

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