The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Sep. 16, 2003
Yoshitarou Yazaki, Anjo, JP;
Tomohiro Yokochi, Kariya, JP;
Koji Kondo, Toyohashi, JP;
Toshikazu Harada, Kariya, JP;
Yoshihiko Shiraishi, Nagoya, JP;
Yoshitarou Yazaki, Anjo, JP;
Tomohiro Yokochi, Kariya, JP;
Koji Kondo, Toyohashi, JP;
Toshikazu Harada, Kariya, JP;
Yoshihiko Shiraishi, Nagoya, JP;
Denso Corporation, Kariya, JP;
Abstract
Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.