The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2007

Filed:

Jun. 10, 2003
Applicants:

Shunzo Yamashita, Musashino, JP;

Kei Suzuki, Kokubunji, JP;

Toshiyuki Aritsuka, Kodaira, JP;

Masayuki Miyazaki, Tokyo, JP;

Sadaki Nakano, Kokubunji, JP;

Inventors:

Shunzo Yamashita, Musashino, JP;

Kei Suzuki, Kokubunji, JP;

Toshiyuki Aritsuka, Kodaira, JP;

Masayuki Miyazaki, Tokyo, JP;

Sadaki Nakano, Kokubunji, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device is employable for a compact and light-weight sensor system that is free of the need for battery replacement. The semiconductor device has a sensor chip (SCHIP) comprising sensors (TD, AS, PD, GS), an A/D conversion circuit (AD), a microprocessor (CPU), a memory (MEM), a transmission circuit (RF), and a power generation circuit (CM). The sensors, the A/D conversion circuit, the microprocessor, the memory, and the transmission circuit are formed on one side (SIDE) of a substrate, while the power generation unit is formed on the other side (SIDE) of the substrate.


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