The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Feb. 19, 2004
Ekrem Oran, Nashua, NH (US);
Ekrem Oran, Nashua, NH (US);
Hittite Microwave Corporation, Chelmsford, MA (US);
Abstract
A novel package includes a substrate including an upper surface ground plane connected to a lower surface ground plane by vias through the substrate, a die located on the upper ground plane and including a die pad, a transmission path including, on the upper surface of the substrate, a bonding pad connected to a first transmission line itself connected to a transition pad, and on the lower surface of the substrate, a second transmission line connected to the transition pad by a via through the substrate. A wire bond extends from the bonding pad to the die pad. A portion of the upper surface ground plane and the lower surface ground plane are connected by vias defining opposing walls on either side of the transmission path for signal isolation. A low pass filter for compensating wire bond inductance includes: a first capacitance formed between the bonding pad and at least the lower surface ground plane, the wire bond inductance, and a second capacitance formed between the die pad and at least the upper surface ground plane.