The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Jan. 12, 2005
Keiichi Fujimoto, Kyoto, JP;
Keiichi Fujimoto, Kyoto, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A wafer collective reliability evaluation device comprises a wafer collective probe disposed so as to face a reliability evaluation wafer and including a wiring substrate, a conductive elastic sheet provided on a surface of the wiring substrate facing the reliability evaluation wafer and a plurality of metal terminals provided in a surface of the conductive elastic sheet and electrically connected to the reliability evaluation wafer. The reliability evaluation wafer comprises a plurality of reliability evaluation elements formed on a main body of a semiconductor wafer, a plurality of electrodes for applying voltage or current to the respective reliability evaluation elements via the respective metal terminals and a plurality of heating elements formed in the vicinity of the respective reliability evaluation elements and serving to control temperatures of the respective reliability evaluation elements.