The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Nov. 19, 2003
Mark Wesselmann, Carlsbad, CA (US);
Kostadin Petkov, San Diego, CA (US);
Robert Metter, Portland, OR (US);
Michael S. Wisnieski, Keizer, OR (US);
John Boyd, Atascadero, CA (US);
Mark Wesselmann, Carlsbad, CA (US);
Kostadin Petkov, San Diego, CA (US);
Robert Metter, Portland, OR (US);
Michael S. Wisnieski, Keizer, OR (US);
John Boyd, Atascadero, CA (US);
Advanced Materials Sciences, Inc., Portland, OR (US);
Abstract
A protective disk for protecting a semiconductor wafer during processing includes an adhesive layer configured to adhere to the semiconductor wafer and a support layer coupled to the adhesive layer configured to provide strength and stiffness to the semiconductor wafer during processing. In one aspect of the invention, the protective disk is soluble in a mildly alkaline or mildly acidic solution. In another aspect, the adhesive layer comprises a high molecular weight polymer. In another aspect, the support layer comprises a polymer and a filler. The present invention may enable a robust, cost-effective, high-volume, automated process for thinning semiconductor wafers below 150 μm, and for subsequent process steps of stress relief and transfer to a dicing frame for die singulation. Additionally, the invention enables use of existing toolsets and processes to produce thinner substrates than conventionally achievable.