The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Dec. 08, 2004
Applicants:
Kyouyuu JO, Osaka, JP;
Yasufumi Miyake, Osaka, JP;
Inventors:
Kyouyuu Jo, Osaka, JP;
Yasufumi Miyake, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention provides a process for producing a substrate for flexible circuit boards which comprises: providing a multilayered insulating resin layer comprising an insulating layer and an adhesive layer; and laminating a metal foil to the insulating layer of the multilayered insulating resin layer via the adhesive layer at a temperature not lower than the glass transition temperature of the insulating layer.