The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2007

Filed:

Sep. 20, 2002
Applicants:

Kazunobu Sakai, Nakakoma-gun, JP;

Makoto Nakashima, Kofu, JP;

Wataru Hirai, Nakakoma-gun, JP;

Yasuyuki Ishitani, Nakakoma-gun, JP;

Inventors:

Kazunobu Sakai, Nakakoma-gun, JP;

Makoto Nakashima, Kofu, JP;

Wataru Hirai, Nakakoma-gun, JP;

Yasuyuki Ishitani, Nakakoma-gun, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); B23P 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A component mounting apparatus and a component mounting method which improve accuracy and a rate of placement of components onto a circuit-formed member. A component sucked by a suction nozzle is recognized at a component recognizing position, a deviation of the component from a normal suction status is determined on the basis of component recognition information obtained from this recognition of the component, and a velocity of conveyance of the component for a period of time following the recognition of the component and preceding placement of the component is controlled on basis of a magnitude of the deviation. By this control, the accuracy and rate of placement of components onto the circuit-formed member can be improved.


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