The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Oct. 14, 2003
Applicant:
Kei Nishioka, Kyoto, JP;
Inventor:
Kei Nishioka, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A packaged semiconductor device has an integrated chip and a non-integrated chip. The integrated chip has an integrated circuit and first bump pads formed with a narrow pitch. The non-integrated chip has second bump pads formed so as to face the first bump pads, lead pads formed with a wide pitch (so as to permit connection thereto of wires), and wiring conductors electrically connecting these pads together. The two chips are connected together by way of bumps and are then sealed in resin. With this structure, it is possible to realize a low-cost packaged semiconductor device that can easily be mounted on a mother board.