The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Aug. 05, 2004
Applicant:
Tsuyoshi Sugiura, Yokohama, JP;
Inventor:
Tsuyoshi Sugiura, Yokohama, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/82 (2006.01);
U.S. Cl.
CPC ...
Abstract
A SAW apparatus is provided capable of realizing a small size without adverse affect while mounting the active surfaces of the semiconductor integrated circuit and the surface acoustic wave element. The SAW apparatus comprises a semiconductor IC and a SAW element. The semiconductor IC is flip-chip mounted on a bottom of the package, a non-active surface of the SAW element is bonded to a non-active surface of the semiconductor IC by using an adhesive, and an electrode portion arranged in the active surface is wire-bonded to an electrode pattern formed on the side walls of the package by using wires.