The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Dec. 16, 2004
Toshifumi Kojima, Aichi, JP;
Makoto Wakazono, Gifu, JP;
Toshifumi Kojima, Aichi, JP;
Makoto Wakazono, Gifu, JP;
NGK Spark Plug Co., Ltd., , JP;
Abstract
A multilayer wiring board () is provided which includes a core substrate () including a plurality of through-holes (). The through-holes () include through-hole conductors () on the inner walls of corresponding penetration holes () of a diameter of 200 μm or less. Interlayer insulating layers () are disposed on opposite sides of the principal planes () of the core substrate (). Wiring layers () are disposed on the surface of interlayer insulating layers (). The through-holes () are filled with a hardened filling material (). Lid conductors () close the openings of the through-holes (). The value of linear expansion of the hardened filling material () is 1.2% or less in the temperature region from room temperature to the solder reflow temperature. The board has excellent connection reliability and exhibits little or no cracking or delamination in the lid conductor closing the openings of the through-holes and in the surrounding conductor area.