The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7183347 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 27, 2007

Filed:

Oct. 29, 2001
Applicants:

Hisanori Ota, Kawasaki, JP;

Toshihiro Sakakibara, Kawasaki, JP;

Inventors:

Hisanori Ota, Kawasaki, JP;

Toshihiro Sakakibara, Kawasaki, JP;

Assignee:

Zeon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 3/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a dip molding, a composition for dip molding, and a method for producing a dip molding. The dip molding is molded from a conjugated diene based rubber latex, crosslinked by a water-soluble multivalent metal salt, and contains substantially none of any of a sulfur-containing vulcanizing agent, a vulcanization accelerator for the vulcanizing agent, and zinc oxide. The dip molding has very few pinholes, has good feel, and has sufficient strength.


Find Patent Forward Citations

Ota, Hisanori. (2007). Dip moldings, composition for dip molding and method for producing dip moldings (U.S. Patent No. 7183347). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7183347

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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