The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Mar. 19, 2003
Akinobu Hira, Kanuma, JP;
Keiichi Hashimoto, Utsunomiya, JP;
Hidehiro Sasaki, Tochigi-ken, JP;
JSP Corporation, Tokyo, JP;
Abstract
A composite foamed polypropylene resin molding including a plurality of sections which are fuse-bonded to each other, at least two of which differ from each other in color, apparent density, composition and/or mechanical strengths, each of which is formed from expanded polypropylene resin beads, and each of which shows a high temperature endothermic peak in a DSC curve thereof. At least one of the sections satisfies conditions (d) to (f) at the same time: (d) to be formed from specific expanded polypropylene resin beads of a base resin having a tensile modulus of at least 1,200 MPa, (e) to have an apparent density Dof 10–500 g/L, and (f) to have such a high temperature endothermic peak with a calorific of EJ/g, wherein Dand Ehave the relationship 20−0.020×D≦E≦65−0.100×DThe composite molding may be prepared by filling expanded polypropylene resin beads in each of a plurality of contiguous spaces defined in a mold cavity and heating the expanded beads to fuse-bond respective expanded beads together into a unitary body. At least one of the spaces is filled with the specific expanded polypropylene resin beads.