The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7182877 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 27, 2007

Filed:

Dec. 10, 2003
Applicants:

Hidetoshi Murai, Matsumoto, JP;

Manabu Hanakawa, Nagano-ken, JP;

Inventors:

Hidetoshi Murai, Matsumoto, JP;

Manabu Hanakawa, Nagano-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method is provided for manufacturing an electro-optical device, in which fine scratches or cracks can be removed by etching without damaging wiring, an electro-optical device, and an electronic apparatus. According to the method, a liquid crystal panel used in an electro-optical device is cut as a single product. Then, before an IC mounting step, in a state of the single product liquid crystal panel, a wet etching is performed on the cut faces and edges of the first and second substrates to remove fine scratches or cracks from the cut faces and edges of the substrates. At this time, wiring portions, IC mounting terminals, substrate mounting terminals, and alignment marks, which are formed on the protruding region, are covered with a protection layer.


Find Patent Forward Citations

Murai, Hidetoshi. (2007). Method for manufacturing electro-optical device, electro-optical device, and electronic apparatus (U.S. Patent No. 7182877). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7182877

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