The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Jun. 30, 2003
Frank N. Mandigo, North Branford, CT (US);
Peter W. Robinson, Glen Carbon, IL (US);
Derek E. Tyler, Cheshire, CT (US);
Andreas Boegel, Weissenhorn, DE;
Hans-achim Kuhn, Illertissen, DE;
Frank M. Keppeler, Stuttgart, DE;
Joerg Seeger, Ulm, DE;
Frank N. Mandigo, North Branford, CT (US);
Peter W. Robinson, Glen Carbon, IL (US);
Derek E. Tyler, Cheshire, CT (US);
Andreas Boegel, Weissenhorn, DE;
Hans-Achim Kuhn, Illertissen, DE;
Frank M. Keppeler, Stuttgart, DE;
Joerg Seeger, Ulm, DE;
Olin Corporation, East Alton, IL (US);
Abstract
A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, from 0.5% to 1.5% of silicon, and the balance is copper and inevitable impurities. Further, the total nickel plus cobalt content is from 1.7% to 4.3%, the ratio of nickel to cobalt is from 1.01:1 to 2.6:1, the amount of (Ni+Co)/Si is between 3.5 and 6, the electrical conductivity is in excess of 40% IACS and the yield strength is in excess of 95 ksi. An optional inclusion is up 1% of silver. A process to manufacture the alloy includes the sequential steps of (a). casting; (b). hot working; (c). solutionizing; (d). first age annealing; (e). cold working; and (f). second age annealing wherein the second age annealing temperature is less than the first age annealing temperature.