The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7182821 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 27, 2007

Filed:

Apr. 14, 2003
Applicants:

Akira Izumi, Kyoto, JP;

Katsuhiko Miya, Kyoto, JP;

Inventors:

Akira Izumi, Kyoto, JP;

Katsuhiko Miya, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B08B 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed is a substrate processing method including a substrate rotating step for rotating a substrate with the substrate held almost horizontally within a chamber; a peripheral edge processing step for discharging a processing liquid to a lower surface of the substrate rotated in the substrate rotating step and causing the processing liquid to flow around an upper surface of the substrate at a peripheral edge thereof from the lower surface of the substrate to process the peripheral edge of the upper surface of the substrate in the chamber; and a both-surface processing step for discharging the processing liquid to both the surfaces of the substrate rotated in the substrate rotating step to process both the surfaces of the substrate in the chamber.


Find Patent Forward Citations

Izumi, Akira. (2007). Substrate processing method and substrate processing apparatus (U.S. Patent No. 7182821). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7182821

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…