The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Nov. 02, 2004
Toru Mizuno, Tokyo, JP;
Tomomi Asakura, Tokyo, JP;
Masatoshi Ito, Tokyo, JP;
Masaaki Kaneko, Tokyo, JP;
Toshinobu Miyagoshi, Tokyo, JP;
Toru Mizuno, Tokyo, JP;
Tomomi Asakura, Tokyo, JP;
Masatoshi Ito, Tokyo, JP;
Masaaki Kaneko, Tokyo, JP;
Toshinobu Miyagoshi, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
The invention provides a mounting method capable of coping with high density mounting, narrower pitch mounting, cavity mounting and the like. In this method, displacement amounts of a chip that is picked up from a wafer by a pick-up nozzle to be held by the pick-up nozzle, with respect to a reference attitude, are obtained, and when the chip is delivered to a mounting nozzle for actually mounting the chip onto a substrate, the displacement amounts are corrected while taking the displacement amounts into consideration, so that the mounting nozzle always holds the chip in a fixed attitude.